By Jong-Hee Park
This instruction manual presents directions and useful info at the chemical vapor deposition (CVD) strategy for floor engineering layout, product improvement, and production. the 1st of the 14 chapters speak about the elemental rules of CVD thermodynamics and kinetics, stresses and mechanical sta
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Additional resources for Chemical Vapor Deposition (Surface Engineering Series, V. 2)
The logical approach to the development of a CVD coating is to first determine the feasibility of a particular coating system. The process itself is basically governed by the following two important mechanisms: • Thermodynamics which determines driving force and • Kinetics which determines the rate control of the chemical reactions. This chapter discusses the basic principles of CVD thermodynamics and kinetics with a brief review of the CVD process. Various fundamental aspects involved in a chemical vapor deposition process are shown in Figure 1.
Single or multi-step reactions at the substrate surface, Basic Principles of CVD Thermodynamics and Kinetics 33 Mullit e Si Fig. 8: 5μ Scanning electron micrograph of the cross-section of a typical mullite coating on SiC using AlCl3-SiCl4-CO2-H2 system at 950°C and 75 torr. a b c Fig. 9: (a) Cross-sectional TEM micrograph of CVD mullite coating on SiC with diffraction patterns from the two regions of the coating, (b) crystalline mullite, and (c) vitreous nano-crystalline layer. 34 Pattanaik and Sarin Bulk Gas 1 7 2 ------------------------------------------------------------------------------- δ 3 6 4 Boundary Layer 5 Coating Substrate Fig.
The film is now stretched so that it once again has the same dimensions as the substrate (Figure 1d). 5. The film is now made to adhere once again to the substrate (Figure 1e). 6. The stress is now no longer applied (Figure 1f). The film tends to contract but the rigid substrate to which it is adhering does not. At mechanical equilibrium, the film/ substrate system is therefore curved. In the example shown in Figure 1, the curve is concave and corresponds to a residual tensile stress in the film.