By Hua-Tay Lin, Dongming Zhu, Tatsuki Ohji, Andrew Wereszczak

This quantity is an invaluable source for figuring out the main necessary facets of complicated ceramic coatings and interfaces. Containing twelve contributed papers from the symposium, subject matters comprise vibration damping coatings, thermal and environmental barrier coating processing, checking out and lifestyles modeling, non-destructive evaluate, multifunctional coatings and interfaces, highlighting the cutting-edge ceramic coatings applied sciences for numerous serious engineering purposes.

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5. 7 μηι in thickness which showed a 60 % increase in oxidation compared to uncoated substrates (Fig. 6a). The illustrated GIXRD scan was taken under a GI angle of 3° which reveals Y-Y2Si207 beside SÌ3N4, S1O2, MgSi03 and a-Y2Si207 (Fig. 6b). 7° and the broad peak caused by co-existing glassy phase was relatively weak, too. The bonding strength of Cu, bonded to the top and bottom sides of the substrates was fairly good and identical for both sides, but less good than the strength of Cu bonded to the top side of Mg-SN.

As can be expected, the coating porosity is the key enabler for such behavior. Hcanowever, the blade tip speed can play an important role as well, as can be seen in Figure 11. Figure 11. Blade wear as a function of coating porosity and blade tip speed for tests performed at 1100 °C ( 2010 °F ) using bare Inconel 718 blade dummies and a 500 μηι/s incursion rate. Top and bottom: Sulzer Meteo 2395; Middle: Durabrade 2192. No significant difference in performance is seen for coatings with a porosity of about 25 percent.

Fig. 8a shows the Y-SN substrate coated with a magnesium sol of composition Mg5 and the corresponding Cu-strip after bonding and peel testing. Compared to uncoated Y-SN substrates the peel strength was strongly increased and blistering was clearly impeded. The SEM micrograph of the Cu- 26 · Advanced Ceramic Coatings and Interfaces IV Magnesia and Yttria Based Coatings for Direct-Copper-Bonding of Silicon Nitride Ceramics bonded substrate (Fig. 5 μπι thickness with a conglomeration of 01-Y2SÌ2O7 crystals in close contact with the Cu-interface.

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